Tsav los ntawm kev lag luam ntawm MiniLED thev naus laus zis xyoo no, Shuote Technology tau ua tiav qhov siab tshiab hauv kev koom tes ntawm lub tshuab sorting, thiab EPS yuav tsum teeb tsa qhov siab tshiab thoob plaws hauv lub xyoo. Shuttle tau hais tias qhov kev thov rau MiniLED xyoo tom ntej yog qhov zoo heev, thiab cov tuam txhab Asmeskas tseem ceeb yuav tsum tau txuas ntxiv mus txais cov thev naus laus zis ntsig txog, uas yog qhov tseem ceeb ntxiv.
Shuttle tsom rua Pick Place pick-thiab-chaw technology, uas tuaj yeem siv rau Sorter thiab Bonder. Cov chaw siv muaj xws li semiconductors, LED / LD, thiab optical iav Cheebtsam.
Shuote signed an authorized cooperation with Huite in 2014 to jointly promote LED sorting machines. At present, the cumulative output of LED sorting machines has exceeded 12,000, including Fucai's Jingdian, Sanan Optoelectronics, and Tongxindian are all customers. .
Shuttle said that this year, thanks to the introduction of MiniLED backlight technology by major American manufacturers, the demand for Mini LED process equipment has increased greatly due to its commercialization. Manufacturers supplying MiniLED chips from major American manufacturers, whether in Taiwan, Malaysia or the future Manufacturers in mainland China all use the company's sorting machine, and almost won the entire market.
Nrhiav rau pem hauv ntej rau xyoo tom ntej, Shuttle tau hais tias nws tseem muaj kev cia siab rau MiniLED kev lag luam xav tau. Los ntawm qhov kev xav ntawm cov neeg siv khoom tawm tswv yim, nws yog qhov zoo heev, tab sis tseem muaj qhov tsis paub tseeb coj los ntawm kev sib kis kom pom.
Raws li rau lub suab nrov dhau los, tom ntej no -vim vaj huam sib luag ntawm ib lub tuam txhab Asmeskas loj tuaj yeem hloov mus rau OLED thev naus laus zis. Shuttle hais tias qhov no tsis muaj tseeb. Cov chaw tsim khoom loj yuav txuas ntxiv qhia nws, uas yog qhov loj ntxiv rau MiniLED daim ntawv thov sab.
Ntxiv nrog rau cov khoom siv LED, Shuttle tseem cog cov khoom siv semiconductor. Xyoo no, nws tau pib ua ntej- npaj loj hloov pauv tuag- cov cuab yeej sib txuas, uas yog siv hauv kiv cua- tawm wafer- qib ntim (FOWLP) thiab kiv cua{{ 4}} tawm vaj huam sib luag- theem ntim (FOPLP), thiab txuas ntxiv nqis peev Nano- qib siab- cov khoom siv sib xyaw ua ke, thiab koom tes nrog Taiwan Industrial Research Institute rau kev txheeb xyuas cov khoom siv, hauv yav tom ntej tuaj yeem siv rau hauv Chiplet (me me) thiab Solderless (tsis yog -tin) heterogeneous bonding advanced ntim txheej txheem.
Shuttle tau hais tias yav tom ntej, nws yuav txuas ntxiv txhim kho cov txheej txheem semiconductor siab heev thiab nthuav dav kev ua haujlwm los ntawm kev koom tes hauv kev lag luam. Nws twb tau ua qhov kev txheeb xyuas qhov project nrog lub Hoobkas semiconductor.
