Tsib feem ntau siv high-power LED crystals nti fabrication txoj kev
Raws li lub teeb pom kev zoo, lub zog loj LEDs muaj qhov zoo ntawm qhov me me, kev siv hluav taws xob tsawg, kev tsim hluav taws xob tsawg, lub neej ntev, kev teb ceev ceev, kev nyab xeeb tsis tshua muaj hluav taws xob, huab cua tsis zoo, thiab kev coj zoo. Lub hau npog sab nrauv tuaj yeem ua los ntawm PC raj, uas tuaj yeem tiv taus qhov kub siab txog 135 degrees thiab qis kub -45 degrees. Raws li lub thib plaub-tiam hluav taws xob lub teeb qhov chaw, high-power LED yog hu ua" ntsuab teeb qhov chaw". Nws muaj cov yam ntxwv zoo xws li qhov me me, muaj kev nyab xeeb thiab tsis tshua muaj hluav taws xob, lub neej ntev, kev ua haujlwm siab electro-optical conversion, ceev teb ceev, txuag hluav taws xob, thiab kev tiv thaiv ib puag ncig. Nws yuav twv yuav raug hu hloov cov tsoos Incandescent teeb, halogen tungsten teeb thiab fluorescent teeb tau dhau los ua lub cim tshiab ntawm lub teeb ci hauv lub xyoo pua 21st.
Cov txheej txheem tsim khoom ntawm high-power LED chips tau sau tseg raws li hauv qab no:
①Tshaj qhov loj ntawm lub ci
Ib qho chaw LED teeb-emitting ib leeg thiab ua kom cov nyiaj tam sim no ntws los ntawm txheej txheej TCL kom ua tiav qhov xav tau sib nqus flux. Txawm li cas los xij, tsuas yog nce lub teeb-emitting cheeb tsam tsis daws qhov teeb meem no, thiab qhov teeb meem kub dissipation tsis tuaj yeem ua tiav cov txiaj ntsig xav tau thiab sib nqus flux hauv kev siv tswv yim.
②Silicon backplane flip-chip txoj kev
Eutectic solder Ua ntej, npaj ib tug loj LED vaj huam sib luag lub teeb nti, thiab npaj ib tug haum loj, ntawm silicon substrate thiab silicon substrate, siv kub eutectic solder txheej thiab conductive txheej conductor (ultrasonic kub hlau pob thiab socket sib koom), thiab siv lub mobile ntaus ntawv [ GG] #39;s LED chips thiab loj-loj silicon substrates uas yog soldered ua ke nrog eutectic solder. Xws li cov qauv tsim nyog, tsis yog tsuas yog xav txog qhov teeb meem no xwb, tab sis kuj xav txog qhov teeb meem ntawm lub teeb thiab cua sov, uas yog lub ntsiab ntawm high-power LED ntau lawm.
③ Flip-chip txoj kev ntawm ceramic phaj
Cov qauv siv lead ua ntawm LED vaj huam sib luag lub teeb nti ntawm cov khoom siv dav dav yog qhov loj tom ntej, cov txheej txheem eutectic solder thiab cov txheej txheem ntawm cov phaj ceramic thiab ceramic substrate, cov khoom siv coj los ua hauv cheeb tsam, vuam electrodes yog siv hauv siv lead ua LED Vuam khoom siv rau vuam ntawm cov chips thiab cov ntawv loj ceramic. Cov qauv zoo li no yog ib qho teeb meem uas yuav tsum tau xav txog, thiab nws kuj yog ib qho teeb meem uas yuav tsum tau xav txog. Kev siv cov thermal conductivity ceramic phaj thiab ceramic daim hlau rau lub teeb thiab cua sov muaj cov nyhuv thermal dissipation zoo heev thiab tus nqi qis. Nws yog qhov tsim nyog rau cov khoom ntim tam sim no thiab qhov chaw tshwj tseg rau kev sib koom ua ke ntawm kev sib koom ua ke yav tom ntej.
④ Sapphire substrate hloov txoj kev
Cov chaw tsim khoom ntawm PN kev sib tshuam tom qab tshem tawm cov sapphire substrate, loj hlob ib qho InGaN nti ntawm sapphire substrate, thiab tom qab ntawd txuas cov khoom siv quaternary ib txwm mus rau qis electrode ntawm xiav LED nti nrog cov qauv loj los ntawm cov txheej txheem.
⑤ AlGaInN silicon carbide (SiC) backside teeb txoj kev
Cree yog lub ntiaj teb no' tsuas yog AlGaInN ultra-ci LED chaw tsim tshuaj paus nrog silicon carbide substrates. Lub architecture ntawm AlGaInN / SICA chips uas tsim nyob rau hauv lub xyoo tau tsis tu ncua txhim kho thiab nce nyob rau hauv brightness. Txij li thaum P-hom thiab N-hom electrodes nyob rau sab saum toj thiab hauv qab ntawm cov nti, feem, siv ib qho kev sib raug zoo, zoo sib xws, yooj yim ntawm kev siv, thiab yog li dhau los ua lwm yam khoom tseem ceeb hauv kev txhim kho AlGaInNLED.
